Abstract
The mechanism of particle-particle interface (PPI) corrosion observed in cold sprayed (CS) Cu immersed in dilute HNO3 has been elucidated. PPI corrosion is initiated by the oxide inclusions present along the PPIs. The accelerated corrosion rate at PPIs results from the combined effects of confined geometry and catalytic reactions, which involve the electrochemical dissolution of Cu and reduction of NO3−. Annealing the CS Cu at 600°C coalesces the oxide inclusions, thereby breaking the interconnected oxide inclusion network. As a result, the propagation of PPI corrosion is impeded.
Supplementary materials
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Supplementary materials
Description
Including supplementary materials information, EBSD analysis, and GC-MS results.
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Video 1. Bubble generation on LT and O-free Cu during the first hour of immersion under NA conditions
Description
Shown in the video was the gas formation process, occurred in the first hour of immersion in naturally aerated 0.1 M HNO3, for LT CS Cu and O-free Cu. It is clear that after ~15 mins of immersion, gas stopped forming visually for the O-free Cu, while for the LT CS Cu, large volumes of gas were still generating, even at the end of the video (1 h). Note that the bubble generation duration corresponded well with the high Ecorr period for the O-free Cu.
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