Abstract
A comprehensive
systematic method for chemical vapour deposition modelling consisting of seven
well defined steps is presented. The method is general in the sense that it is
not adapted to a certain type of chemistry or reactor configuration. The method
is demonstrated using silicon carbide (SiC) as model system, with accurate
matching to measured data without tuning of the model. We investigate the cause
of several experimental observations for which previous research only have had
speculative explanations. In contrast to previous assumptions, we can show that
SiCl2 does not contribute to SiC deposition. We can confirm the
presence of larger molecules at both low and high C/Si ratios, which have been
thought to cause so-called step-bunching. We can also show that high
concentrations of Si lead to other Si molecules than the ones contributing to
growth, which also explains why the C/Si ratio needs to be lower at these
conditions to maintain high material quality as well as the observed saturation
in deposition rates. Due to its independence of chemical system and reactor
configuration, the method paves the way for a general predictive CVD modelling
tool.
Supplementary materials
Title
A method for in-silico Chemical Vapour Deposition Supplementary material rev1
Description
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